Semiconductor packaging technology, a microchip contains tens of billions of transistors, criss-crossed links and orderly work, whether it is Kirin 990 or Snapdragon 855, the combination is the score and speed, semiconductor assembly is a complex splicing process , it is necessary to control each section of the process well in order to obtain a good and stable product. Chip encapsulation, BGA chip underfill, solder joint encapsulation, wire reinforcement, die bond, component fixation and other dispensing operations play a key role in the stable work of semiconductors.

       As the needs of the small chip dispensing process, we provide Die Bonding Tools ( Epoxy Stamping Tools , Micro Dispensing Nozzle , Pick-up Tools , Ejector Needles)

       Glue Volume 20μm-600μm

       High quality finishing on precise micro holes 
       Perfect round holes , hole cylindricity controlled

       Tolerance ±1μm

       Material: tungsten carbide, ceramic , stainless steel